Nanowire field effect transistor device having a replacement gate

ABSTRACT

A device includes a substrate, a buffer layer, a nanowire, a gate structure, and a remnant of a sacrificial layer. The buffer layer is above the substrate. The nanowire is above the buffer layer and includes a pair of source/drain regions and a channel region between the source/drain regions. The gate structure surrounds the channel region. The remnant of the sacrificial layer is between the buffer layer and the nanowire and includes a group III-V semiconductor material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/821,884, filed Aug. 10, 2015, which is a divisional of U.S. patentapplication Ser. No. 14/101,715, now U.S. Pat. No. 9,136,332, filed Dec.10, 2013, both of which are incorporated herein by reference in theirentirety.

TECHNICAL FIELD

The technology described in this disclosure relates generally tonanowire-based devices and more particularly to nanowire-based fieldeffect transistors (FETs) and techniques for the fabrication thereof.

BACKGROUND

Gate all around (GAA) nanowire channel field effect transistors (FETs)may enable feature scaling beyond current planarcomplementary-metal-oxide semiconductor (CMOS) technology. Nanowirechannel FETs may also be of interest due to their electrostatics, whichmay be superior to those of conventional FET devices. The fabrication ofnanowire channel FETs may include generating a collection of nanowiresand placing them where desired (e.g., a bottom-up approach) or mayinclude various lithographic patterning procedures (e.g., a top-downapproach).

BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1A, 1B, and 1C depict example steps that may be used infabricating a gate all around (GAA), lateral nanowire field effecttransistor (FET).

FIG. 2 depicts a patterned semiconductor substrate, where the patternedsemiconductor substrate may include a fin structure surrounded byshallow trench isolation (STI) material.

FIGS. 3 and 4 depict an exemplary trench that may be formed by etchingthe fin structure.

FIG. 5 depicts example epitaxial layers formed substantially over thesemi conductor substrate.

FIG. 6 depicts an example etching of the STI material, where the etchingmay be used to expose a channel layer and a etch layer.

FIGS. 7 and 8 depict additional example structures that may be formed byetching the STI material.

FIGS. 9, 10, and 11 depict the formation of an example dummy gatesubstantially over the channel layer of the FET, where spacer materialmay be formed at ends of the example dummy gate.

FIGS. 12, 13, and 14 depict an interlayer dielectric (ILD) layer thatmay be formed substantially over the FET structure.

FIGS. 15, 16, and 17 depict a removal of the example dummy gate.

FIGS. 18, 19, and 20 depict an example etching of the etch layer.

FIGS. 21 and 22 depict further aspects of the example etching of theetch layer, where an etch time is varied to control an amount of etchundercutting beneath source and drain regions of the FET.

FIGS. 23, 24, and 25 depict an example high-k dielectric layer that isdeposited over a portion of the nanowire, where the high-k dielectriclayer may form a first portion of a replacement gate.

FIGS. 26, 27, and 28 depict an example metal gate layer that isdeposited over the portion of the nanowire, where the metal gate layermay form a second portion of the replacement gate.

FIGS. 29, 30, and 31 depict an alternative embodiment of the exampleGAA, lateral nanowire FET structure, where the alternative embodimentmay use a thin etch layer to form a tri-gate structure.

FIGS. 32, 33, and 34 depict example source and drain regions of the GAA,lateral nanowire FET.

FIGS. 35, 36, and 37 depict example source and drain regions, where theexample source and drain regions may be formed in an alternativeembodiment of the GAA, lateral nanowire FET.

FIGS. 38, 39, and 40 depict second example source and drain regions ofthe GAA, lateral nanowire FET.

FIGS. 41, 42, and 43 depict second example source and drain regions,where the second example source and drain regions may be formed in analternative embodiment of the GAA, lateral nanowire FET.

FIGS. 44-49 depict example material system options for a GAA, lateralnanowire FET.

FIGS. 50-53 depict additional example material system options for a GAA,lateral nanowire FET.

FIG. 54 is a flowchart illustrating an example method for forming ananowire field effect transistor (FET) device.

DETAILED DESCRIPTION

FIGS. 1A, 1B, and 1C depict example steps that may be used infabricating a gate all around (GAA), lateral nanowire field effecttransistor (FET). As illustrated in FIG. 1A at 120, a fin structure maybe disposed substantially over a semiconductor substrate 110. Thesemiconductor substrate may include silicon, SiGe, Ge, or asemiconductor such as InP, InAs, AlAs, AlP, or GaAs. The fin structuremay include a buffer layer 108 formed substantially over thesemiconductor substrate 110, an etch layer 104 (e.g., a sacrificiallayer) formed substantially over the buffer layer 108, and a channellayer 102 formed substantially over the etch layer 104. The layers 102,104, 108 may be provided via an epitaxial growth process. In an example,the channel layer 102 and/or the etch layer 104 may comprise non-siliconsemiconductor materials, such that the buffer layer 108 may be providedto compensate for a lattice mismatch between the semiconductor substrate110 and the channel layer 102 and/or the etch layer 104 (e.g., in caseswhere the semiconductor substrate 110 is silicon).

The channel layer 102 may comprise a non-silicon nanowire that is usedto provide a channel region of the lateral nanowire FET. For example,FIGS. 1A, 1B, and 1C may depict cross-sectional views of differentstages in the fabrication of the lateral nanowire FET, where thecross-sectional views are taken at a gate region of the FET. Thus, alength of the nanowire 102 may extend a distance in the y-direction(i.e., into the page), and source and drain regions of the FET (notdepicted in the cross-sectional views of FIGS. 1A, 1B, and 1C) may beconnected by the nanowire 102. In the example of FIGS. 1A, 1B, and 1C,the fin structure including the channel layer 102, the etch layer 104,and the buffer layer 108 may be surrounded by shallow trench isolation(STI) material 106. The STI material 106 may include an oxide materialor another type of material configured to provide electrical isolationbetween adjacent fin structures or other structures fabricated over thesubstrate 110.

At 140 of FIG. 1B, the etch layer 104 may be etched. In an example, theetching may be performed following a removal of a dummy gate structurethat is deposited around a portion of the nanowire 102. In this example,the removal of the dummy gate structure may expose the portion of thenanowire 102 and the sacrificial layer 104 thereunder (i.e., a portionof the sacrificial layer 104 that is directly below the portion of thenanowire 102), such that the exposed portion of the etch layer 104 maythereafter be etched. The etching may be selective to the etch layer104, such that the channel layer 102 is not etched, and the buffer layer108 is also not etched a significant amount. As illustrated at 140 ofFIG. 1B, the etching may cause a portion of the nanowire 102 to besuspended over the semiconductor substrate 110.

At 160 of FIG. 1C, a replacement gate that surrounds the portion of thenanowire 102 may be formed. As described above, the fabrication of thelateral nanowire FET may involve the use of the dummy gate structure,and the replacement gate may be used to replace the dummy gate structurefollowing the removal of the dummy gate structure. The replacement gatemay be formed using an example HKMG process (i.e., a high-k dielectric,metal gate process). In the example HKMG process, a first high-kdielectric layer 112 and a metal gate layer 114 may be deposited in aconformal manner over all sides of the nanowire 102, as depicted in FIG.1C. In an example, the conformal deposition may be provided using anatomic layer deposition (ALD) process. Following the conformaldeposition, the nanowire 102 may no longer be suspended over thesemiconductor substrate.

FIG. 1C further depicts a second high-k dielectric layer 116 that may bedeposited substantially over the STI material 106 and the buffer layer108. The second high-k dielectric layer 116 may be formed during thedeposition of the first high-k dielectric layer 112. For example, indepositing the first high-k dielectric layer 112 to coat the sides ofthe nanowire 102, high-k dielectric material may also be deposited overthe STI material 106 and the buffer layer 108, thus forming the layer116. As described in further detail below, the second high-k dielectriclayer 116 may help to prevent the gate region of the FET from shortingto the buffer layer 108, which may reduce gate leakage current.

In the end-product device structure depicted at 160 of FIG. 1C, thechannel region of the lateral nanowire FET, provided by the nanowire102, may be electrically isolated from the semiconductor substrate 110.The electrical isolation may be a consequence of i) the selectiveetching of the etch layer 104, which may physically isolate the channellayer 102 from the bulk substrate (i.e., as depicted at 140 of FIG. 1B),and ii) the replacement HKMG process that may provide the gate allaround structure, where the gate all around structure may comprise thelayers 112, 114, 116 surrounding the channel layer 102 (i.e., asdepicted at 160 of FIG. 1C).

As noted above, the channel layer 102 may be a non-silicon semiconductormaterial that is provided via an epitaxial growth process. Thenon-silicon semiconductor material used for the channel layer 102 mayinclude, for example, compound group III-V semiconductors, group IVsemiconductors, or other materials. Such compound group III-Vsemiconductors or group IV semiconductors may comprise high mobilitychannel materials and may be used to replace silicon nanowires used inconventional nanowire FET devices. The replacement of the siliconnanowires with the high mobility semiconductor materials may becomplicated by various issues, however. For example, the high mobilitychannel materials having a different lattice parameter to silicon may behighly defective at the epitaxially formed interface with silicon.Further, implant doping to create an isolation well may not be a simplematter in the group III-V and IV semiconductors, and bulk-like or bufferlayers of high mobility semiconductors may be conductive, thus leadingto unwanted source-drain leakage currents.

The lateral nanowire field effect transistor (FET) described above withreference to FIGS. 1A, 1B, and 1C may address the issues describedabove. By growing the epitaxial etch layer 104 under the channel layer102 and subsequently removing the etch layer 104 via a selective etchtechnique, the FET may have a high crystalline quality channel materialthat is electrically isolated from the bulk substrate. The nanowire 102may be combined with the HKMG process described above to make the GAAfinFET structure, and the GAA finFET structure may be compatible withVLSI design rules and various processing requirements (e.g.,International Technology Roadmap for Semiconductors (ITRS)specifications). The GAA finFET structure may be used to fabricate groupIII-V or IV finFET devices with good electrostatic control and lowleakage, as described in further detail below. The structure and methoddescribed herein may be equally applicable to NMOSFET and PMOSFETtechnologies.

FIGS. 2-31 depict example steps in forming a GAA lateral nanowire FETdevice. FIG. 2 depicts a patterned semiconductor substrate 202, wherethe patterned semiconductor substrate 202 may include a fin structure203. The fin structure 203 may be surrounded by shallow trench isolation(STI) material 204. The STI material 204 may include an oxide materialor another type of material configured to provide electrical isolationbetween adjacent fin structures or other structures fabricated over thesubstrate 202.

FIGS. 3 and 4 depict an exemplary trench 205 that may be formed byetching the fin structure 203. As illustrated at 270 of FIG. 3, a depth(“d”) of the trench 205 may be equal to a thickness of the STI material204. Alternatively, as illustrated at 275 of FIG. 4, the depth of thetrench 205 may comprise only a percentage of the thickness of the STImaterial 204. For example, the depth of the trench 205 may be equal toone third of the thickness of the STI material 204 or one half of thethickness of the STI material 204. As illustrated in the examples at 270and 275, a profile of the bottom of the trench 205 may be flat, rounded,or V-shaped, among other geometries.

FIG. 5 depicts example epitaxial layers 206, 208, 210 formedsubstantially over the semiconductor substrate 202. The exampleepitaxial layers may include a channel layer 206, an etch layer 208(i.e., a sacrificial layer), and a buffer layer 210. The layers 206,208, 210 may be provided via one or more epitaxial growth processes. Thechannel layer 206 may include a non-silicon nanowire that is used toprovide a channel region of the GAA, lateral nanowire FET. In anexample, the etch layer 208 may comprise a non-silicon semiconductormaterial (e.g., a group III-V semiconductor material), such that thebuffer layer 210 may be provided to compensate for a lattice mismatchbetween the semiconductor substrate 202 and the etch layer 208. The oneor more epitaxial processes used to grow the layers 206, 208, 210 may becombined with various other processing techniques (e.g., cleaningprocesses, recess processes, or chemical mechanical polishing (CMP)processes, etc.) to achieve the structure depicted in FIG. 5.

A thickness of the channel layer 206 (i.e., “t_(channel)”) may be withina range of approximately 5 nm to 30 nm. A thickness of the etch layer208 (i.e., “t_(etch)”) may be within a range of approximately 1 nm to 15nm. A thickness of the buffer layer 210 (i.e., “t_(buffer)”) may bewithin a range of approximately 20 nm to 300 nm. Such thicknesses areexemplary only, and the layers 206, 208, 210 may be fabricated tovarious other thicknesses. In an example, the thickness t_(etch) may beone to fifteen times smaller than the thickness t_(channel), which maycause the etch layer 208 to comprise a strained layer. The use of astrained layer for the etch layer 208 may increase a number of potentialmaterial systems that may be used in fabricating the etch layer 208.Because the etch layer 208 is a sacrificial layer that is removed via anetch process, the increased number of potential material systems mayallow a greater etch selectivity to be engineered.

FIG. 6 depicts an example etching of the STI material 204, where theetching may be used to expose the channel layer 206 and the etch layer208. The STI material 204 may be etched until the etch layer 208 isfully exposed or partially exposed. Further, the STI material 204 may beover-etched or under-etched, as illustrated in FIGS. 7 and 8. In FIG. 7,at 280, the STI material 204 may have been over-etched, such that athickness Δd of the buffer layer 210 is exposed at a top surface of theSTI material 204. In FIG. 8, at 285, the STI material 204 may have beenunder-etched, such that a thickness Δd of the etch layer 208 is recessedwithin the STI material 204. Other methods of achieving the structuresdepicted in FIGS. 6-8 may be used.

FIGS. 9, 10, and 11 depict the formation of an example dummy gate 212substantially over the channel layer 206 of the FET, where an extension214 may be formed at ends of the example dummy gate 212. In FIGS. 9 and10, a “gate cross-section” and an “extension cross-section” may bedepicted, respectively. Cut-lines illustrating a location of the gatecross-section and the extension cross-section may be illustrated in FIG.11, which illustrates the structure rotated by 90 degrees (e.g., asevidenced by the x/y/z axes depicted in the different portions of FIGS.9 and 11). In the gate cross-section, the dummy gate 212 may be formedsubstantially over the channel layer 206 and the etch layer 208, suchthat the dummy gate 212 surrounds three sides of the channel layer 206and two sides of the etch layer 208. The portion of the channel layer206 over which the dummy gate 212 is formed may comprise a nanowirechannel region of the lateral nanowire FET, where the nanowire channelregion connects source and drain regions of the FET.

In the extension cross-section, the extension 214 may be formedsubstantially over the channel layer 206 and the etch layer 208, suchthat the extension 214 surrounds three sides of the channel layer 206and two sides of the etch layer 208. The extension 214 may comprise aspacer material, and the spacer material may be, for example, a nitridespacer, an oxide spacer, or another type of spacer material. The spacermaterial may be used to maintain integrity of the gate region or otherportions of the semiconductor structure throughout the fabricationprocess (e.g., to reduce interaction with aggressive chemicals that maybe used in further processing). Following the formation of the dummygate 212 and the extension 214, source and drain regions of the FET maybe formed. In the interest of clarity, the source and drain regions maynot be depicted in FIGS. 9-31. Reference is made to FIGS. 32-34,described in further detail below, which may depict exemplary source anddrain regions.

Similar to FIGS. 9-11, FIGS. 12-31 may depict a gate cross-sectionalview, an extension cross-sectional view, and a third view of thestructure that is rotated by 90 degrees (i.e., where the gatecross-sectional view, the extension cross-sectional view, and the thirdview are ordered as such from left to right). FIGS. 12, 13, and 14depict an interlayer dielectric (ILD) layer 216 that may be formedsubstantially over the FET structure. In FIGS. 12, 13, and 14, the ILDlayer 216 may be formed over portions of the channel layer 206 that arenot covered by the dummy gate 212 or the extension 214.

FIGS. 15, 16, and 17 depict a removal of the example dummy gate 212. Asdepicted in FIGS. 15, 16, and 17, the removal of the example dummy gate212 may create an opening 218 (e.g., an etch window), and the opening218 may expose a portion of the channel layer 206 and a portion of theetch layer 208.

FIGS. 18, 19, and 20 depict an example etching of the etch layer 208. Inetching the etch layer 208, the opening 218 formed by the removal of thedummy gate 212 may expose the portion of the etch layer 208 to anetchant, thus facilitating the etching. A wet etchant (i.e., an aqueousetchant) or a dry etchant (e.g., a reactive ion etch (RIE) etchant) maybe used to selectively remove the etch layer 208 without removing thechannel layer 206. Example wet etchants that may be used include HCl,C₆H₈O₇, and NH₄OH, among others. Example dry etchants that may be usedinclude HCl, SiCl₄, SF₆, BCl₃, or Cl₂, among others. The selectivity ofthe etching may also enable the buffer layer 210 to not be substantiallyetched, or the buffer layer 210 may be partially removed by the etching.Thus, the etchant may have a property that enables a high etch rate forthe etch layer 208 and a low etch rate for the channel layer 206 and thebuffer layer 210.

As illustrated in FIGS. 18, 19, and 20, the etching causes the portionof the nanowire 206 to be suspended over the semiconductor substrate202. The portion of the nanowire 206 that is suspended may comprise thechannel region of the GAA, lateral nanowire FET. The suspended nanowire206 may be anchored at each end by the extension 214 (i.e., the spacermaterial) and the ILD layer 216.

The etching of the etch layer 208 may be understood as includingmultiple aspects. In a first aspect of the etching, a first portion ofthe etch layer 208 may be etched, where the first portion may comprisethe portion of the etch layer 208 that is directly exposed to theetchant via the opening 218. In a second aspect of the etching, a secondportion of the etch layer 208 may be etched, where the second portionmay comprise a portion of the etch layer 208 that is removed via etchundercutting. The portion of the etch layer 208 that may be removed viathe etch undercutting may be characterized by a distance L, as depictedin FIGS. 18, 19, and 20. The etch undercutting may occur under thesource and drain regions of the FET (not depicted in FIGS. 18, 19, and20), and the distance L may be the distance over which the etchundercutting extends beneath the source or drain region. The portion ofthe etch layer 208 that is removed via the etch undercutting may not bedirectly exposed to the etchant.

FIGS. 21 and 22 depict further aspects of the example etching of theetch layer 208, where an etch time is varied to control an amount ofetch undercutting beneath the source and drain regions of the FET. InFIGS. 18-22, the distance L over which the etch undercutting extendsbeneath the source or drain region may be determined based on an amountof time used in etching the etch layer 208. By varying the etch time,the undercut length L may be varied to achieve a desired effect, withlimiting cases being L=0 (i.e., no etch undercutting beneath the sourceand drain regions, as depicted in FIG. 21 at 290) and L=L_(S/D), whereL_(S/D) may be equal to a length of the source or drain region of theFET (i.e., as depicted in FIG. 22 at 295). A minimization of processingtime may be desired, and to achieve this desired effect, the etch timemay be engineered to cause L=0. Alternatively, it may be desirable tominimize source-to-drain leakage by removing semiconductor material thatconnects the source and drain regions, and to achieve this desiredeffect, the etch time may be engineered to cause L=L_(S/D). Incontrolling the source-to-drain leakage based on the distance L, thedistance L may determine a degree to which areas of the source or drainregion are electrically isolated from the buffer layer 210, or thedistance L may determine a potential barrier between the source/drainregion and the buffer layer, which is higher than an operation voltageof the FET. In the embodiment to achieve this desired effect, the etchtime may be engineered to cause 0≤L≤Lchannel, where Lchannel is thechannel length. And in another embodiment to achieve this desiredeffect, the etch time may be engineered to cause Lchannel≤L≤L_(S/D).

FIGS. 23, 24, and 25 depict an example high-k dielectric layer 220 thatis deposited over a portion of the nanowire, where the high-k dielectriclayer 220 may form a first portion of a replacement gate. The high-kdielectric layer 220 may be deposited in a conformal manner, such thatthe high-k dielectric layer 220 may surround all sides of the nanowire206. The conformal deposition may be achieved using an atomic layerdeposition (ALD) process. The high-k dielectric layer 220 may be A1 ₂O₃,HfO₂, La₂O₃, or ZrO₂, among others. A process temperature used in thedeposition of the high-k dielectric layer 220 may be within a range ofapproximately 100-300 degrees Celsius.

As illustrated in FIGS. 23, 24, and 25, the conformal deposition mayfurther cause the high-k dielectric layer 220 to be formed over the STImaterial 204, the buffer layer 210, and on sidewalls of the etchedportion of the etch layer 208. The high-k dielectric layer 220 that isdeposited on the buffer layer 210 and the sidewalls of the etchedportion of the etch layer 208 may prevent a gate region of the FET fromshorting i) to source and drain regions of the FET, and/or ii) to thebuffer layer 210. The high-k dielectric layer 220 deposited in theseareas may thus be configured to reduce gate leakage.

FIGS. 26, 27, and 28 depict an example metal gate layer 222 that isdeposited over the portion of the nanowire, where the metal gate layer222 may form a second portion of the replacement gate. The metal gatelayer 222 may be deposited in a conformal manner, such that the metalgate layer 222 may surround all sides of the nanowire 206. Asillustrated in FIGS. 26, 27, and 28, following the deposition of themetal gate layer 222, the nanowire 206 may no longer be suspended overthe semiconductor substrate 202. The conformal deposition may beachieved using an ALD process. As illustrated in FIGS. 26, 27, and 28,the conformal deposition may further cause the metal gate layer 222 tobe deposited in the cavity that is formed in the etch layer 208. Themetal gate layer 222 may include TiN, TaN, Pd, or Pt, among others. Thestructure depicted in FIGS. 26, 27, and 28 may be an example end productdevice structure for a first embodiment of the example GAA, lateralnanowire FET structure described herein.

FIGS. 29, 30, and 31 depict a second embodiment of the example GAA,lateral nanowire FET structure, where the second embodiment may use athin etch layer 208 to form a tri-gate structure. The structure depictedin FIGS. 29, 30, and 31 may be an example end product device structurefor the second embodiment. In FIGS. 29, 30, and 31, the etch layer 208may have a thickness that is less than twice the thickness of the high-kdielectric layer 220. Using the thin etch layer 208, a gap between thechannel layer 206 and the buffer layer 210 may be closed during thedeposition of the high-k dielectric layer 220, such that the metal gatelayer 222 may not be able to completely surround the nanowire 206. Inthis example, the device may utilize the tri-gate structure, where thechannel region of the channel layer 206 is isolated from the bulk (e.g.,the buffer layer 210) by the high-k dielectric layer 220. In anotherembodiment, a ratio of the thickness of the high-k dielectric layer tothe thickness of a diameter of the nanowire determined by the channelregion of the channel layer is between about ⅓ and 1, such that it maybe desirable to minimize source-to-drain leakage by removingsemiconductor material that connects the source and drain regions. Incontrolling the source-to-drain leakage based on the ratio, the ratiomay determine a potential barrier between the source/drain region andthe buffer layer higher than an operation voltage of the FET.

FIGS. 32, 33, and 34 depict example source/drain regions 224 of the GAA,lateral nanowire FET. FIGS. 32-43 include layers similar to thosedescribed above, with reference to FIGS. 2-31, and reference numbers forthe similar layers are carried over from the earlier figures. Thesimilar layers included in FIGS. 32-43 are not described in furtherdetail herein, and reference is made to the descriptions for FIGS. 2-31above. In FIGS. 32, 33, and 34, the source/drain regions 224 may bedescribed as “source/drain junctions,” as illustrated in the figures.The source/drain regions 224 may be formed in the channel layer 206, andthe source/drain regions 224 may be (a) ion implanted, (b)metal-semiconductor compounds, (c) a combinations of (a) and (b), or (d)both of (a) and (b). The source/drain regions 224 may be formed afterthe deposition of the spacer material 214 in the replacement gate flowprocess. FIGS. 35, 36, and 37 may be similar to FIGS. 32, 33, and 34 andmay depict the formation of the source/drain junctions 224 in the secondembodiment of the example GAA, lateral nanowire FET structure (e.g., thesecond embodiment described above with reference to FIGS. 29-31).

In a left-most portion of FIGS. 32 and 33, an “etch layer removed”cross-section and an “etch layer not removed” cross-section may bedepicted, respectively. Cut-lines illustrating the locations of thesecross-sections may be illustrated in FIG. 34, which illustrates thestructure rotated by 90 degrees (e.g., as evidenced by the x/y/z axesdepicted in the different portions of FIGS. 32 and 34). At the “etchlayer removed” cross-section, the source/drain region 224 may beelectrically isolated from the buffer layer 210. By contrast, at the“etch layer not removed” cross-section, the source/drain region 224 maynot be isolated from the buffer layer 210. As described above, adistance L over which the etch undercutting extends beneath thesource/drain regions 224 may be determined based on an amount of timeused in etching the etch layer 208. The distance L may thus determine adegree to which areas of the source/drain regions 224 are electricallyisolated from the buffer layer 210. Further, an amount of leakagecurrent between the source region and the drain region that flowsthrough the buffer layer 210 may be determined based on the distance L.

FIGS. 38-40 may be similar to FIGS. 32-34 and FIGS. 41-43 may be similarto FIGS. 35-37. In FIGS. 38-40, second example source/drain regions 226of the FET are formed. The second source/drain regions 226 may be formedvia an epitaxial process that occurs after the deposition of the spacermaterial 214. FIGS. 41-43 may be similar to FIGS. 38-40 and may depictthe formation of the second source/drain regions 226 in the secondembodiment of the example GAA, lateral nanowire FET structure (e.g., thesecond embodiment described above with reference to FIGS. 29, 30, and31). In an example, the epitaxial source/drain regions 226 may becombined with the source/drain junctions 224 of FIGS. 32-37.

FIGS. 44-49 depict example material system options for a GAA, lateralnanowire FET. Group III-V semiconductor material system options for thebuffer layer may include InAs, InP, or GaSb. Group III-V semiconductormaterial system options for the etch layer may include InP or GaSb(e.g., strained on InAs), In_(x)Al_(1-x)As (0.5≤x≤1.0),AlAs_(x)Sb_(1-x), or In_(x)Ga_(1-x)As_(y)Sb_(1-y). Group III-Vsemiconductor material system options for the channel layer may includeIn_(x)Ga_(1-x)As (0.5≤x≤1.0), InAs_(y)Sb_(1-y) (0.6≤y≤1.0), orIn_(x)Ga_(1-x)Sb (0.0≤x≤0.5).

Group IV semiconductor material system options for the buffer layer mayinclude Si, Si_(x)Ge_(1-x) (0.0≤x≤1.0), or Ge. Group IV semiconductormaterial system options for the etch layer may include Ge (e.g., Gestrained on Si). Further, an AlAs_(y)P_(1-y) (0.0≤y≤1.0, optionallylattice matched to the buffer) etch layer that is grown between group IVlayers may be used. Group IV semiconductor material system options forthe channel layer may include Si, Si_(x)Ge_(1-x) (0.0≤x≤0.5), orSi_(1-x)Ge_(1-x) (0.0≤x≤1.0).

FIGS. 50-53 depict additional example material system options for a GAA,lateral nanowire FET. Specifically, FIGS. 50-53 may illustrate the useof dopant selective etching (DSE). In DSE, the nanowire and the etchlayer may both comprise a same material. The nanowire may have a firstdoping level that is different than a second doping level of the etchlayer. In one example, the etch layer may be doped more heavily than thenanowire. The DSE process may be used to selectively remove the etchlayer based on the differences in the doping levels between the nanowireand the etch layer. DSE may similarly be used to achieve etchselectivity between the etch layer and the buffer layer.

As illustrated in FIGS. 50-53, for Group IV semiconductor materials, thebuffer layer may be Si, the etch layer may be Si_(x)Ge_(1-x) that isheavily doped, and the channel layer may be Si or Si_(x)Ge_(1-x).Alternatively, for Group IV semiconductor materials, the buffer layermay be Si_(x)Ge_(1-x) (0.0≤x≤1.0), the etch layer may be Si_(x)Ge_(1-x)that is heavily doped, and the channel layer may be Si_(x)Ge_(1-x)(0.0≤x≤1.0). For Group III-V semiconductor materials, the buffer layermay be InP, the etch layer may be a heavily doped In_(x)Ga_(1-x)As layerthat may be lattice matched to the buffer layer, and the channel layermay be In_(x)Ga_(1-x)As (0.5≤x≤1.0). Alternatively, for Group III-Vsemiconductor materials, the buffer layer may be InAs or GaSb, the etchlayer may be a heavily doped InAs_(y)Sb_(1-y) or In_(x)Ga_(1-x)Sb layerthat may be lattice matched to the buffer layer, and the channel layermay be InAs_(y)Sb_(1-y) (0.6≤y≤1.0) or In_(x)Ga_(1-x)Sb (0.0≤x≤0.5).

FIG. 54 is a flowchart 600 illustrating an example method for forming ananowire field effect transistor (FET) device. At 602, a sacrificiallayer is provided over a semiconductor substrate. At 604, a nanowire isformed over the sacrificial layer via an epitaxial process. At 606, adummy gate is formed around a portion of the nanowire, where the portionof the nanowire comprises a channel region of a lateral nanowire FET.The channel region connects source and drain regions of the FET. At 608,the dummy gate is replaced with a replacement gate. At 610, thereplacing includes removing the dummy gate to expose the portion and thesacrificial layer thereunder. At 612, the replacing includes etching thesacrificial layer after the removal of the dummy gate. The etching isselective to the sacrificial layer to prevent the removal of thenanowire, and the etching causes the portion of the nanowire to besuspended over the semiconductor substrate. At 614, the replacingincludes forming the replacement gate that surrounds the portion of thenanowire. The replacement gate is deposited in a conformal manner overall sides of the portion, such that the portion is no longer suspendedover the semiconductor substrate.

Accordingly, one aspect of the instant disclosure provides a device,which comprises: a substrate; a buffer layer above the substrate; ananowire above the buffer layer and including a pair of source/drainregions and a channel region between the source/drain regions; a gatestructure surrounding the channel region; and a remnant of a sacrificiallayer between the buffer layer and the nanowire and including a groupIII-V semiconductor material.

Accordingly, another aspect of the instant disclosure provides a method,which comprises: providing a device including a substrate, a bufferlayer above the substrate, a nanowire above the buffer layer, and asacrificial layer between the buffer layer and the nanowire; andremoving the sacrificial layer beneath a source/drain region of thenanowire.

Accordingly, yet another aspect of the instant disclosure provides adevice, which comprises: a substrate; a buffer layer above thesubstrate; a nanowire above the buffer layer and including a pair ofsource/drain regions and a channel region between the source/drainregions; a gate structure surrounding the channel region; and a remnantof a sacrificial layer between the buffer layer and the nanowire andincluding a group IV semiconductor material.

This written description uses examples to disclose the disclosure,including the best mode, and also to enable a person skilled in the artto make and use the disclosure. The patentable scope of the disclosuremay include other examples. It should be understood that as used in thedescription herein and throughout the claims that follow, the meaning of“a,” “an,” and “the” includes plural reference unless the contextclearly dictates otherwise. Also, as used in the description herein andthroughout the claims that follow, the meaning of “in” includes “in” and“on” unless the context clearly dictates otherwise. Further, as used inthe description herein and throughout the claims that follow, themeaning of “each” does not require “each and every” unless the contextclearly dictates otherwise. Finally, as used in the description hereinand throughout the claims that follow, the meanings of “and” and “or”include both the conjunctive and disjunctive and may be usedinterchangeably unless the context expressly dictates otherwise; thephrase “exclusive of” may be used to indicate situations where only thedisjunctive meaning may apply.

1-20. (canceled)
 21. A semiconductor device, comprising: a semiconductorsubstrate; a semiconductor buffer layer disposed over the semiconductorsubstrate; an isolation insulating layer surrounding the buffer layer; asemiconductor nanowire disposed above the buffer layer and having asource region, a drain region and a channel region between the sourceregion and the drain region; a gate dielectric layer surrounding thesemiconductor nanowire; and a gate electrode layer disposed over thegate dielectric layer and surrounding the semiconductor nanowire,wherein at a bottom of the semiconductor nanowire, the gate dielectriclayer and the gate electrode layer laterally extend below the sourceregion and the drain region of the semiconductor nanowire.
 22. Thesemiconductor device of claim 21, further comprising a source epitaxiallayer disposed over the source region and a drain epitaxial layerdisposed over the drain region.
 23. The semiconductor device of claim21, further comprising a sacrificial layer disposed between thesemiconductor buffer layer and the semiconductor nanowire.
 24. Thesemiconductor device of claim 23, wherein at the bottom of thesemiconductor nanowire, the gate dielectric layer and the gate electrodelayer are disposed between a first part of the sacrificial layer and asecond part of the sacrificial layer.
 25. The semiconductor device ofclaim 24, wherein: the bottom of the semiconductor nanowire, the bufferlayer, the first part of the sacrificial layer and the second part ofthe sacrificial layer from a cavity, and the gate dielectric layer isdisposed on inner surfaces of the cavity and the gate electrode fillsthe cavity.
 26. The semiconductor device of claim 23, further comprisinga source epitaxial layer disposed over the source region and a drainepitaxial layer disposed over the drain region.
 27. The semiconductordevice of claim 26, wherein the source epitaxial layer and the drainepitaxial layer cover side surfaces of the sacrificial layer.
 28. Thesemiconductor device of claim 23, wherein the semiconductor buffer layeris made of one selected from the group consisting of InAs. InP and GaSb.29. The semiconductor device of claim 28, wherein the sacrificial layeris made of a different material than the semiconductor buffer layer andthe semiconductor nanowire, and is made of one selected from the groupconsisting of includes InP, GaSb, In_(x)Al_(1-x)As, AlAs_(x)Sb_(1-x) andIn_(x)Ga_(1-x)As_(y)Sb_(1-y).
 30. The semiconductor device of claim 23,wherein the semiconductor buffer layer and the semiconductor nanowireare made of Si, and the sacrificial layer is made of silicon germanium.31. A semiconductor device, comprising: a semiconductor substrate; asemiconductor buffer layer disposed over the semiconductor substrate; anisolation insulating layer surrounding the buffer layer; a semiconductornanowire disposed above the buffer layer and hacing a source region, adrain region and a channel region between the source region and thedrain region; a gate dielectric layer surrounding the semiconductornanowire; and a gate electrode layer disposed over the gate dielectriclayer and surrounding the semiconductor nanowire, wherein at a bottom ofthe semiconductor nanowire, the gate dielectric layer laterally extendsbelow the source region and the drain region of the semiconductornanowire.
 32. The semiconductor device of claim 31, further comprising asacrificial layer disposed between the semiconductor buffer layer andthe semiconductor nanowire.
 33. The semiconductor device of claim 32,wherein at the bottom of the semiconductor nanowire, the gate dielectriclayer is disposed between a first part of the sacrificial layer and asecond part of the sacrificial layer.
 34. The semiconductor device ofclaim 33, wherein: the bottom of the semiconductor nanowire, the bufferlayer, the first part of the sacrificial layer and the second part ofthe sacrificial layer form a cavity, and the gate electrode is notdisposed in the cavity.
 35. The semiconductor device of claim 32,further comprising a source epitaxial layer disposed over the sourceregion and a drain epitaxial layer disposed over the drain region. 36.The semiconductor device of claim 35, wherein the source epitaxial layerand the drain epitaxial layer cover side surfaces of the sacrificiallayer.
 37. A semiconductor device, comprising: a semiconductorsubstrate; a semiconductor fin structure disposed over the semiconductorsubstrate; an isolation insulating layer surrounding the semiconductorfin structure; a semiconductor nanowire disposed above the semiconductorfin structure and having a source region, a drain region and a channelregion between the source region and the drain region; a gate dielectriclayer surrounding the semiconductor nanowire; and a gate electrode layerdisposed over the gate dielectric layer and surrounding thesemiconductor nanowire.
 38. The semiconductor device of claim 37,wherein at a bottom of the semiconductor nanowire, the gate dielectriclayer laterally extends below the source region and the drain region ofthe semiconductor nanowire.
 39. The semiconductor device of claim 38,wherein at a bottom of the semiconductor nanowire, the gate electrodelayer laterally extends below the source region and the drain region ofthe semiconductor nanowire.
 40. The semiconductor device of claim 37,further comprising a sacrificial layer disposed between thesemiconductor fin structure and the semiconductor nanowire.